All AMTECH solder pastes conform to ANSI/J-STD-006 and are available for immediate delivery in jars, cartridges, syringes and ProFlow Cassettes. They are also available in FreshMix™ kits. Our customer representatives are ready to discuss your SMT requirements. We offer a short turn around time on orders and can ship to meet your just-in-time requirements.

To help us meet your particular needs, please provide us with information on your alloy, flux type, powder size and packaging preferences.

If you are not sure which combination is best for your process or have questions regarding soldering techniques, procedures or products, our technical support staff will assist you.

AMTECH is committed to bringing you the most advanced solder paste formulations available; and we back our products with a highly trained staff which is ready to support you with all of your present and future assembly requirements.


 

 

No-Clean Solder Pastes Class

SynTECH

Data Sheet (PDF)

MSDS (PDF)

The SynTECH series solder paste is a synthetic poly-adduct designed to exceed requirements for reliable solder joints in SMT PC board assemblies. This paste was formulated to replace traditional rosin/resin based no-clean formulations with more reliable synthetic materials. The residue is pin probable for ICT inspection. The SynTECH series does not require refrigeration if left at room temperature for 6 months and has a 12-month refrigerated shelf life.

ROL0

NC-559

Data Sheet (PDF)

MSDS (PDF)

The NC-559 series is designed to meet requirements for reliable solder joints in SMT PC board assemblies. This formula was designed to have a wider process window and better compatibility with OSP surfaces. This formulation exhibits long print life in continuous printing operations. Residue can be removed using traditional solvents or Kyzen's Aquanox® with semi-aqueous systems.

 

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NC-559-AS

Data Sheet (PDF)

MSDS (PDF)

The 559-AS solder paste was formulated with an extended tack and stencil life. The residue of 559-AS is pin probable for ICT inspection. This formula is designed to be very robust with a wider profiling window.

 

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NC-559-ASM

Data Sheet (PDF)

MSDS (PDF)

The NC-559-ASM is a modified version of the NC-559-AS that contains a U.V. tracer for easier flux splatter inspection. This modified version is completely odorless. This product is designed for manual or semi-automatic stencil printing, where the operator is exposed to the smell of the product.

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NC-560-LF

Data Sheet (PDF)

MSDS (PDF)

NC-560-LF is a lead-free, no-clean, halide-free solder paste that delivers improved solderability with all Pb-Free metallization, including ENIG (Gold), OSP, HASL and immersion silver boards. NC-560-LF is RoHS-compliant and increases production yields with its unparalleled lot-to-lot and stencil printing consistency, and offers superior print performance characteristics, including excellent wetting, strong activity, ideal viscosity, long stencil life, thermal stability up to 300°C, and minimal residue. NC-560-LF is also low beading, low voiding, and anti-tombstoning to reduce scrap and rework.

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SynTECH-LF
Lead-Free

Data Sheet (PDF)

MSDS (PDF)

SynTECH-LF has been formulated to work with all lead-free formulations, including lead-free tin/silver/copper alloys without compromising SIR values. It is compatible with many lead-free board finishes and delivers excellent wetting with a light colored residue. Residues can be removed using traditional solvents or Kyzen's Aquanox with semi-aqueous systems. Kyzen's Aquanox saponifiers can be used to remove flux residues.

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LF-4300

Data Sheet (PDF)

MSDS (PDF)

A revolutionary new lead-free solder paste, LF-4300 offers true multi-process capabilities, a no-clean formula that is also water washable without saponification. Highly versatile and forgiving, LF-4300 uses synthetic materials for unparalleled lot-to-lot consistency and ideal printing characteristics (no mid-chip beading, low voiding and anti-tombstoning). LF-4300 is also compatible with high temperature alloys. It’s also VOC and halide-free, and features 12-hour stencil life and 24-hour abandonment time.

REL0

4300

Data Sheet (PDF)

MSDS (PDF)

A revolutionary new solder paste designed for tin-lead alloys. 4300 offers true multi-process capabilities, a no-clean formula that is also water washable without saponification. Highly versatile and forgiving, 4300 uses synthetic materials for unparalleled lot-to-lot consistency and ideal printing characteristics (no mid-chip beading, low voiding and anti-tombstoning). This solder paste is VOC and halide-free, and features 12-hour stencil life and 24-hour abandonment time. REL0

Water Soluble Solder Pastes Class

WS-486

Data Sheet (PDF)

MSDS (PDF)

The WS-486 is a non-resin formula that was developed to replace earlier water-soluble creams, containing no insoluble components. Excellent printability and stencil life is obtained for the most demanding applications, including hard to solder metallization, and harsh operating environments.

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NWS-4100

Data Sheet (PDF)

MSDS (PDF)

The AMTECH NWS-4100 series is a new class of water washable formulations. Scientists at AMTECH have developed a water-soluble version of the innovative polymer-dendrimer activator system. This activator system, coupled with a highly stable, clean rinsing binder, provides the excellent activity, working life, and cleaning needed for today's demanding applications. Excellent in reducing voiding with BGA packages. Residues can be removed with de-ionized or soft tap water at 130-150°F.

REM0

NWS-4200

Data Sheet (PDF)

MSDS (PDF)

The AMTECH NWS-4200 series is a water washable formulation. This formulation uses the innovative polymer-dendrimer activator system. This activator system, coupled with a highly stable, clean rinsing binder, provides an increased activity. Excellent in reducing voiding with BGA packages. Residues can be removed with de-ionized or soft tap water at 130-150° F.

REM0

NWS-4200-4

Data Sheet (PDF)

MSDS (PDF)

The AMTECH NWS-4200-4 series is a new class of water washable formulations designed for difficult/oxidized pads and parts as well as OSP surfaces. This activator system, coupled with a highly stable, clean rinsing binder, provides excellent activity and working life. This formulation is not designed for BGA packages.

REH0

NWS-4200-6

Data Sheet (PDF)

MSDS (PDF)

The AMTECH NWS-4200-6 series is a new class of water washable formulations designed for difficult/oxidized pads and parts as well as OSP surfaces. This activator system, coupled with a highly stable, clean rinsing binder, provides excellent activity and working life. This formulation is not designed for BGA packages. Also designed for the use of lead-free parts on a tin-lead process.

REH1

NWS-4200-4P3

Data Sheet (PDF)

MSDS (PDF)

The AMTECH NWS-4200-4P3 series is a water washable formulation designed for difficult/oxidized pads and parts as well as OSP surfaces. AMTECH developed this water-soluble version to be used in a very dry environment. This product will maintain its tack time and stencil life as it is coupled with a highly stable, clean rinsing binder that provides excellent activity. This product is not recommended for BGA packages. REH0

NWS-4200-LF

Data Sheet (PDF)

MSDS (PDF)

The AMTECH NWS-4200-LF is a water washable formulation that is formulated and designed to meet the reflow temperatures for lead-free alloys. The NWS-4200-LF exhibits exceptional print, long stencil life, and a wide reflow window. This Pb-free solder paste can maintain excellent cleanability even at elevated reflow temperatures.

REH1

NWS-4400-HA

Data Sheet (PDF)

MSDS (PDF)

AMTECH NWS-4400-HA solder paste was designed for hard-to-solder surfaces with a higher activity. The NWS-4400-HA is classified as REL0 and is available in both leaded and non-leaded alloys. Residues can be removed with de-ionized or soft tap water at 130-150° F.

REL0

LF-4300

Data Sheet (PDF)

MSDS (PDF)

A revolutionary new lead-free solder paste, LF-4300 offers true multi-process capabilities, a no-clean formula that is also water washable without saponification. Highly versatile and forgiving, LF-4300 uses synthetic materials for unparalleled lot-to-lot consistency and ideal printing characteristics (no mid-chip beading, low voiding and anti-tombstoning). LF-4300 is compatible with high temperature alloys. It’s also VOC and halide-free, and features 12-hour stencil life and 24-hour abandonment time.

 

REL0

4300

Data Sheet (PDF)

MSDS (PDF)

A revolutionary new solder paste designed for tin-lead alloys. 4300 offers true multi-process capabilities, a no-clean formula that is also water washable without saponification. Highly versatile and forgiving, 4300 uses synthetic materials for unparalleled lot-to-lot consistency and ideal printing characteristics (no mid-chip beading, low voiding and anti-tombstoning). This solder paste is VOC and halide-free, and features 12-hour stencil life and 24-hour abandonment time.

 

REL0


RMA Solder Pastes Class

RMA-223

Data Sheet (PDF)

MSDS (PDF)

The RMA-223 solder paste is a homogeneous mixture of the highest quality pre-alloyed solder powders and mildly activated resin paste flux. With a special blend of gelling additives in this formulation, it prevents segregation of solder cream and provides a creamy mixture ready for application. The residue from RMA-223 is light amber and clear of solder balls. RMA-223 is a cream conforming to ANSI/J-STD-004-006.

 

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RMA-223-AS

Data Sheet (PDF)

MSDS (PDF)

RMA-223-AS is specially designed for today's SMT applications. It is a homogeneous mixture of the highest quality pre-alloyed solder powders and mildly activated resin paste flux. The RMA-223-AS has an increased activity over the RMA-223. The residue from RMA-223-AS can be removed using traditional solvents or Kyzen's Aquanox® with semi-aqueous systems. The residue from the RMA-223-AS is light amber in color.

ROM0
RMA-223-LF

Data Sheet (PDF)

MSDS (PDF)

RMA-223-LF is a solder paste designed to meet the requirements of lead-free. It delivers excellent wetting and spread with Sn96.5/Ag3.5 alloy. It was designed for this alloy only. The 223-LF residue is light amber in color and is non-corrosive. The residue can be removed with solvent or Kyzen’s Aquanox with semi-aqueous systems.

 

ROM1
RMA-259-HT

Data Sheet (PDF)

MSDS (PDF)

The RMA-259-HT is designed with a higher activity than the RMA-223-AS. This product is designed for high temperature alloys, such as Sn10/Pb88/Ag2. This formula is classified as an RMA and the residues can be left on the board or removed using traditional solvents or Kyzen's Aquanox® with semi-aqueous systems.

REL0

FreshMix solder paste kits are the ideal answer to tough production questions. Each FreshMix kit contains 5 jars of pre-measured paste flux, 5 bags of UniSphere™ powder packed in an inert atmosphere, gloves, work surface covers and a mixing tool. Available in a variety of formulations, each kit makes 2,500g of fresh solder paste. Keep FreshMix kits on your shelf and mix fresh solder paste as you need it. No refrigeration is necessary.

Data Sheet (PDF)

MSDS (PDF)